SiloprenSilicone
Silopren Gel 6209
2K addition-cure silicone gel, clear
Solvent-free 1:1 clear silicone gel for potting modules, cable joints and electronics; room-temperature or heat-accelerated cure.
Technical data
| Mix ratio A:B | 1:1 en peso (lotes emparejados) |
|---|---|
| Viscosity | A 900 mPa·s; B 600 mPa·s |
| Pot life | 60 min at 23 °C |
| Cure | 1 h at 100 °C (test) |
| Penetration | 90 (1/10 mm, cone ¼) |
| Dielectric strength | 20 kV/mm |
| Thermal conductivity | 0,17 W/m·K |
| Storage | ≤27 °C |
Recommended for: Electronics protection
Need the technical data sheet (TDS) and safety data sheet (SDS)?
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.