MG Chemicals
Epoxy potting resins for protecting electronics; the technician picks the reference for each case.
Viamonte will tell you the exact 832 series reference for your application.
View technical data →Hoenle Eleco
1K modified acrylate-isocyanate, UV/visible cure with secondary moisture cure in shadow areas
UV-curing acrylate with secondary moisture cure for encapsulating components on boards.
View technical data →Hoenle Eleco
1K modified acrylate, UV/visible cure, optically clear
Optically clear, soft UV-cure encapsulation gel; an alternative to silicone.
View technical data →Momentive
Clear 2K addition-cure silicone, heat cure
Clear heat-curing 2K silicone encapsulant for LEDs and displays.
View technical data →Hoenle Eleco
1K modified epoxy, solvent-free, heat cure
Heat-curing 1K epoxy for chip underfill, capillary flow and fast cure.
View technical data →For electronics protection (conformal coating (non-UV)) we choose the product based on your materials, service conditions and process. Send us your enquiry and a Viamonte technical expert will reply with the latest TDS and SDS.
Novasil
1K neutral alkoxy silicone
Clear 1K silicone with good adhesion to glass and plastics and resistance to temperature and UV.
View technical data →Momentive
2K addition-cure silicone gel
2K silicone gel for encapsulating and protecting delicate electronics.
View technical data →Momentive
Low-outgassing 2K RTV silicone
Low-outgassing 2K silicone for optics, aerospace and sensitive electronics.
View technical data →SilTrust
Low-outgassing 2K RTV silicone
Low-outgassing red elastomer for vacuum/space and a wide temperature range; requires primer on non-silicone surfaces.
View technical data →Momentive
2K condensation RTV silicone, wide temperature range
2K silicone for service at very low and very high temperatures.
View technical data →Hoenle Eleco
Highly filled 1K modified acrylate (glass 35 %), UV/visible cure
Highly filled, low-shrinkage UV acrylate for bonding and sealing plastics, glass and metal and protecting components.
Use: Component protection
View technical data →Structalit
1K modified epoxy with quartz filler (65 %), heat cure
High-Tg, low-CTE underfill with good flow at elevated temperature, for protecting joints under components.
Use: Component underfill
View technical data →Vitralit
1K acrylate, UV/VIS cure
Highly thixotropic UV adhesive for cell block spacers in batteries and SMD protection; hard, dry surface, low shrinkage and good adhesion to FR4.
Use: SMD protection
View technical data →Vitralit
1K epoxy, UV + heat cure
UV/thermal encapsulant for soldered joints and connector solder points and for flexible conductors, with high adhesion to polyimide and low halogen content.
Use: Encapsulation/glob top on flex and connectors
View technical data →Vitralit
1K acrylate-isocyanate, UV/VIS + moisture cure
UV adhesive/glob top with moisture post-cure, jettable, for encapsulating welds in cell contacting systems and glob tops; flux-compatible and low in halogens.
Use: Glob top / solder joint encapsulation
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
Low-viscosity conformal coating with a tack-free surface and moisture post-cure; flux-compatible.
Use: UV conformal coating
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure, fluorescent
Fluorescent potting material, easy to dispense and fast curing, flux-compatible and pseudoplastic.
Use: PCB potting
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
High-Tg adhesive with deep cure and moisture post-cure for batteries and connector bonding; flux-compatible and low ionic content.
Use: Connector bonding on PCB
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
Connector bonding adhesive that passes UL94 HB, high Tg, fast cure, flux-compatible and low ionic content.
Use: Connector bonding on PCB
View technical data →Vitralit
1K epoxy, UV cure, Black & Light technology
Thick-layer UV-curable black adhesive (Black & Light) for encapsulation, light shielding and lens bonding; low shrinkage.
Use: Black glob top
View technical data →Vitralit
1K epoxy, UV cure
Flexible low-viscosity UV resin for micro-imprinting, diffractive diffusers/MLA and as fill material in frame & fill for semiconductors; low Sb content.
Use: Fill in frame & fill
View technical data →Vitralit
1K epoxy, UV + heat cure
Stable glob top/frame for NTC and frame & fill, with low water absorption, high Tg and high ionic purity.
Use: Glob top / frame
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
Use: Glob top / frame
View technical data →Vitralit
Acrylate, UV/VIS cure (+ heat according to the Automotive brochure), fluorescent
Soft elastic coating for flexible circuits (FPCB) and conformal coating, fast curing with a dry, tack-free surface.
Use: Conformal coating / FPCB coating
View technical data →Vitralit
1K epoxy, UV + heat cure
Flexible, low-viscosity optical adhesive/potting, resistant to moisture and sterilisation, with excellent adhesion to plastics and metals; USP Class VI and ISO 10993-5.
Use: Optical potting
View technical data →Vitralit
1K epoxy, UV + heat cure
Low-viscosity, high ionic purity, high-Tg UV/thermal epoxy for partial potting/coating and as fill in frame & fill; low shrinkage and low CTE; ISO 10993-5.
Use: Partial potting / fill
View technical data →Vitralit
Filled acrylate, UV + heat cure
Stable filled adhesive for staking capacitors and large components, with high adhesion to metals and sintered substrates.
Use: Capacitor staking / edge bonding
View technical data →Vitralit
Epoxy, UV + heat cure
High-Tg UV/thermal underfill with low transmission loss and excellent chemical resistance.
Use: UV/thermal underfill
View technical data →Vitralit
UV + heat cure, fluorescent
Very low viscosity sprayable conformal coating, fluorescent, shadow post-curable, flexible, autoclavable and with high chemical resistance.
Use: UV conformal coating
View technical data →Vitralit
UV + heat cure, fluorescent
Flexible, fluorescent, autoclavable conformal coating with very high chemical resistance.
Use: UV conformal coating
View technical data →Vitralit
Epoxy, UV cure
Flexible fill and coating material for small semiconductor chips, low ionic content and low water absorption; passes UL94 HB.
Use: Fill in frame & fill
View technical data →Vitralit
Acrylate, UV/VIS cure
Dry-surface, flexible, tear-resistant UV adhesive with good resistance to moisture and thermal cycling, for edge bonding and glass/plastic bonding; CMR-free.
Use: Component edge bonding
View technical data →Structalit
2K epoxy, room-temperature/heat cure
Two-component epoxy for capacitor bonding, corner bonding and general structural bonding, with very good dielectric properties.
Use: Capacitor staking
View technical data →Structalit
1K epoxy, heat cure
Beige one-component epoxy with short low-temperature cure for structural bonding, magnets, glob top and sensor potting; highly resistant to oils, greases and media, low outgassing and low ionic content; ISO 10993-5.
Use: Glob top / sensor potting
View technical data →Structalit
1K epoxy, heat cure
Glob top with fast low-temperature cure, excellent shock resistance and very high chemical resistance.
Use: Glob top
View technical data →Structalit
1K epoxy, heat cure
Stable black frame material for frame & fill, applicable wet-on-wet and in several layers, with very high shock resistance.
Use: Frame in frame & fill
View technical data →Structalit
1K epoxy, heat cure
Black fill material for PCB encapsulation (e.g. level sensors) and frame & fill, with very high chemical, thermal and shock resistance.
Use: Encapsulation / fill
View technical data →Structalit
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
Use: SMD fixing/protection
View technical data →Structalit
1K epoxy, heat cure
Fast-curing red SMD adhesive, resistant to soldering temperatures, for protecting and fixing components.
Use: SMD adhesive
View technical data →Structalit
Epoxy, heat cure, fluorescent
Fast, low-temperature curing SMD adhesive, easy to dispense, screen-printable and suitable for pin transfer.
Use: SMD adhesive
View technical data →Structalit
1K epoxy, heat cure
Stable high-Tg black epoxy as the frame in frame & fill with the Structalit 5717/5719/5720 fills and for edge bonding; no bleeding and very low ionic content, suitable for semiconductors.
Use: Frame / edge bonding
View technical data →Structalit
Epoxy, heat cure
Fill material for frame & fill in semiconductors, with very good flow, high Tg and no bleeding.
Use: Fill in frame & fill
View technical data →Structalit
1K epoxy, heat cure
High-Tg fill material for frame & fill, with very good flow and no bleeding.
Use: Fill in frame & fill
View technical data →Structalit
Epoxy, heat cure
Black frame material for frame & fill, resistant to vibration and impact and with low ionic content.
Use: Frame in frame & fill
View technical data →Structalit
1K epoxy, heat cure
Black epoxy with fast low-temperature cure and good shock resistance, for medical disposables and as fill in frame & fill; ISO 10993-5.
Use: Fill in frame & fill
View technical data →Structalit
2K epoxy, room-temperature/heat cure
Two-component epoxy for PCB potting with high resistance to grease, oil, chemicals and moisture, low shrinkage and high adhesion to metal, glass and plastic.
Use: PCB potting
View technical data →Structalit
2K epoxy, heat/room-temperature cure
Clear low-viscosity two-component epoxy for PCB potting, resistant to moisture and chemicals.
Use: PCB potting
View technical data →Structalit
1K epoxy, heat cure
Low-Tg flexible epoxy curing at low temperature for potting sensitive components and glob top; jettable, flux-compatible and resistant to temperature and humidity changes.
Use: Flexible potting / glob top
View technical data →Structalit
Epoxy, heat cure
Connector bonding adhesive with low ionic content, high modulus and high elongation, resistant to vibration and shock, with excellent adhesion to LCP and PBT.
Use: Connector bonding
View technical data →Structalit
Epoxy, heat cure
Low-modulus flexible adhesive for connectors with excellent adhesion to LCP and PBT, suited to temperature-sensitive substrates (cures from 60 °C).
Use: Connector bonding
View technical data →Structalit
Epoxy, heat cure
Low-CTE adhesive for connectors with excellent adhesion to LCP and PBT, resistant to chemicals and vibration, for temperature-sensitive substrates.
Use: Connector bonding
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive/potting for bonding sensors and heat sinks, with excellent adhesion to metals, high strength and good flow.
Use: Thermally conductive potting
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
Use: High-temperature potting
View technical data →Kömmerling
Solvent-free 2K polyurethane, cures at room T° regardless of humidity
Very low viscosity version of Körapur 672 for potting; proposed for potting/coating heat exchangers.
Use: Electronics protection
View technical data →Bacon / Fiber Resin (H.B. Fuller Aerospace)
Aerospace epoxy
Aerospace epoxy from the Bacon/Fuller range: electrical potting 0.23 W/mK, surface-mount, anti-vibration, resistant to salt water and Fuel C.
Use: Electronics protection
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 0,30 W/mK, electrical potting.
Use: Electronics protection
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 0,30 W/mK, inverter/solar potting.
Use: Electronics protection
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 1,8 W/mK, thermal encapsulation.
Use: Electronics protection
View technical data →MG Chemicals
2K potting epoxy
Low-permittivity two-component epoxy potting compound for charger receivers, controllers and wiring harnesses.
Use: Epoxy potting
View technical data →MG Chemicals
2K potting epoxy
Low-permittivity two-component epoxy potting compound for receivers, controllers and wiring harnesses.
Use: Epoxy potting
View technical data →MG Chemicals
Rigid 2K potting epoxy
General-purpose epoxy encapsulant that cures rigid; used to give IP68 to junction boxes of flowmeters and submersible sensors.
Use: Epoxy potting
View technical data →MG Chemicals
Optically clear 2K potting epoxy
Clear epoxy resin that cures rigid, submersible in water; allows visual inspection of components and protects LED domes against impact.
Use: Clear epoxy potting
View technical data →MG Chemicals
2K potting epoxy
Two-component epoxy potting compound from the 832 series.
Use: Epoxy potting
View technical data →MG Chemicals
Flexible 2K potting epoxy
Black flexible epoxy encapsulant for protecting LED drivers.
Use: Epoxy potting
View technical data →MG Chemicals
2K thermally conductive potting epoxy
Thermally conductive (non-flame-retardant) potting epoxy for LED drivers and strips and battery modules.
Use: Epoxy potting
View technical data →MG Chemicals
1K potting epoxy
One-component epoxy potting compound.
Use: Epoxy potting
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid, thermally conductive, flame-retardant epoxy encapsulant (non-halogenated fillers) for batteries, LED drivers and electronics with fire risk.
Use: Flame-retardant epoxy potting
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid thermally conductive, flame-retardant epoxy encapsulant, UL94 V-0 certified, for LED drivers and battery packs.
Use: Flame-retardant epoxy potting
View technical data →MG Chemicals
Flexible flame-retardant 2K potting epoxy
Flame-retardant flexible epoxy encapsulant for aggressive thermal cycling.
Use: Flame-retardant epoxy potting
View technical data →MG Chemicals
Flame-retardant 2K potting epoxy
Flame-retardant epoxy potting compound from the 834 series.
Use: Flame-retardant epoxy potting
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
Use: Silicone potting
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
Use: Electronics protection
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
Use: Silicone potting
View technical data →MG Chemicals
Clear RTV potting silicone
Clear RTV potting silicone that cushions impacts and protects LEDs against photo-oxidation.
Use: Electronics protection
View technical data →MG Chemicals
Potting polyurethane
Polyurethane potting resin with very good protection against water ingress and elasticity at very low temperature (family data).
Use: Polyurethane potting
View technical data →MG Chemicals
Potting polyurethane
Polyurethane potting resin with very good protection against water ingress and elasticity at very low temperature (family data).
Use: Polyurethane potting
View technical data →MG Chemicals
Potting polyurethane
Polyurethane potting resin with very good protection against water ingress and elasticity at very low temperature (family data).
Use: Polyurethane potting
View technical data →MG Chemicals
1K acrylic conformal coating
Economical, easily reworkable one-component acrylic coating with UV tracer for inspection.
Use: Acrylic conformal coating
View technical data →MG Chemicals
1K acrylic conformal coating
Reworkable one-component acrylic coating with IPC-CC-830C and UL746E certification.
Use: Acrylic conformal coating
View technical data →MG Chemicals
1K silicone-modified acrylic conformal coating
Soft, flexible acrylic-silicone coating with a wide temperature range; protection of avionics and LED domes.
Use: Silicone conformal coating
View technical data →MG Chemicals
1K silicone-modified acrylic conformal coating
Flexible, water-resistant acrylic-silicone coating with a wide temperature range.
Use: Silicone conformal coating
View technical data →MG Chemicals
1K polyurethane conformal coating
One-component polyurethane coating with strong protection against solvents and corrosive gases.
Use: Polyurethane conformal coating
View technical data →MG Chemicals
2K epoxy conformal coating
Flexible two-component epoxy coating with maximum chemical protection, suitable for ECUs exposed to salt, fuels and oils.
Use: Epoxy conformal coating
View technical data →MG Chemicals
Clear 1K insulating varnish (acrylic, modified alkyd)
Clear insulating varnish with high dielectric strength for coils, windings and PCBs; low VOC and HAP-free.
Use: Insulating varnish
View technical data →MG Chemicals
1K dielectric coating (acrylic, modified alkyd)
Dielectric coating for high-voltage insulation with class H insulation up to 180 °C per UL EIS.
Use: Insulating varnish
View technical data →MG Chemicals
Red 1K insulating varnish (acrylic, modified alkyd)
Red insulating varnish with high dielectric strength, liquid and aerosol; low VOC and HAP-free.
Use: Insulating varnish
View technical data →MG Chemicals
Liquid stripper for conformal coating
Liquid stripper for removing conformal coating from large areas in repair or rework; removes acrylics, alkyds, polyurethanes, silicones and some epoxies.
Use: Conformal coating stripper
View technical data →MG Chemicals
Gel stripper for conformal coating
Gel stripper for local removal of conformal coating and some adhesives.
Use: Conformal coating stripper
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, moisture cure
Black, thixotropic, low-flammability silicone sealant-adhesive for electronics, aerospace and equipment. Neutral cure releasing alcohol; primers SS4004/SS4044/SS4179 for difficult substrates.
Use: Electronics protection
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility
White, non-corrosive, low-outgassing paste adhesive-sealant for electronics joints on vertical/overhead surfaces. Neutral cure releasing methanol; primers SS4004P/SS4044P/SS4179 on difficult substrates.
Use: Electronics protection
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White fluid neutral-cure silicone sealant, non-corrosive on copper/brass, for insulating and protecting PCBs and connections. Primers SS4004/SS4044/SS4179 on difficult substrates.
Use: Electronics protection
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White neutral-cure silicone paste sealant, non-corrosive, for electronics and protecting connections. Primers SS4004/SS4044/SS4179 recommended on difficult substrates.
Use: Electronics protection
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, high-strength electronic grade
High-strength grey neutral-cure silicone paste sealant, non-corrosive on Cu/brass, for electronics. Primers SS4004/SS4044/SS4179 on difficult substrates.
Use: Electronics protection
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, moisture cure
Neutral-cure silicone adhesive-sealant for sealing and fixing in electronics, with primerless adhesion to metals, copper, plastics and glass and slight thermal conductivity.
Use: Electronics protection
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility
Low-volatility neutral-cure silicone sealant for sealing electrical components, with primerless adhesion to many substrates.
Use: Electronics protection
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility, flowable
Fluid neutral-cure, low-volatile silicone sealant for sealing electronics, with primerless adhesion.
Use: Electronics protection
View technical data →Momentive
1K neutral RTV silicone, moisture cure
Translucent silicone paste sealant for electronics and high-performance plastics, with primerless adhesion to polycarbonate and non-corrosive on copper.
Use: Electronics protection
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White neutral-cure electronic silicone (RTV5240 series) for sensitive metals, plastics and painted surfaces.
Use: Electronics protection
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, thixotropic
Thixotropic neutral-cure silicone, non-corrosive to metals, for electrical/electronic insulation and moisture protection; primerless adhesion to many plastics.
Use: Electronics protection
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, semi-flowable
Semi-fluid, non-corrosive neutral-cure silicone for electrical/electronic insulation and moisture protection.
Use: Electronics protection
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, flowable
Fluid, non-corrosive neutral-cure silicone for electrical/electronic insulation and thin-layer moisture protection.
Use: Electronics protection
View technical data →SilTrust
2K addition-cure silicone, heat cure, thermally conductive
Black 1:1 two-component heat-curing silicone encapsulant, self-extinguishing and slightly thermally conductive, for electrical and motor potting.
Use: Electronics protection
View technical data →Silopren
2K addition-cure silicone gel, clear
Solvent-free 1:1 clear silicone gel for potting modules, cable joints and electronics; room-temperature or heat-accelerated cure.
Use: Electronics protection
View technical data →Momentive
Clear 2K addition-cure silicone, low viscosity
10:1 two-component potting silicone, a different formulation from RTV615, flexible down to −115 °C.
Use: Electronics protection
View technical data →Momentive
2K addition-cure silicone
10:1 two-component potting silicone, different from RTV615 and RTV655, with electrical/optical properties and bulk cure.
Use: Electronics protection
View technical data →Momentive
Silicone dielectric gel (RTV6100 series)
Dielectric gel cited in the master file for protecting delicate electronics in harsh environments and damping shock and vibration.
Use: Electronics protection
View technical data →Momentive
Silicone dielectric gel (RTV6100 series)
Dielectric gel cited in the master file for protecting delicate electronics in harsh environments and damping shock and vibration.
Use: Electronics protection
View technical data →Momentive
2K condensation RTV silicone, high temperature
Fluid red high-temperature silicone elastomer for potting motors and transformers; requires primer to adhere to non-silicone surfaces.
Use: Electronics protection
View technical data →SilTrust
2K condensation RTV silicone
White two-component silicone for electrical and aerospace potting; primer SS4004P on non-silicone surfaces.
Use: Electronics protection
View technical data →SilTrust
2K condensation RTV silicone
White two-component silicone for electronic/aerospace potting; primer SS4004P on non-silicone surfaces.
Use: Electronics protection
View technical data →SilTrust
2K condensation RTV silicone, high temperature
Red two-component silicone for potting modules, connectors and coils at high temperature.
Use: Electronics protection
View technical data →Your privacy, your choice
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