ElecolitConductive adhesives
Elecolit 3648
1K epoxy, heat cure (snap cure / thermode)
Very flexible conductive adhesive for foil substrates (flex PCB, metal foils), organic photovoltaics and die attach; cures from 80 °C, snap cure or by thermode.
Technical data
| Viscosity | 10.000–15.000 mPa·s (Rheometer 10 s⁻¹) |
|---|---|
| Volume resistivity | 3–4 × 10⁻⁴ Ω·cm |
| Cure | <1 min/115 °C; 30 min/80 °C |
Recommended for: Conductive and shielding
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.