MG Chemicals
MG Chemicals 8331D
Conductive adhesives
2K silver-filled epoxy, electrically conductive
Silver-filled 2K epoxy for electrically conductive joints; replaces the discontinued 8331.
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MG Chemicals
MG Chemicals 8330D
Conductive adhesives
2K silver-filled epoxy, electrically conductive
Silver-filled 2K epoxy with higher conductivity than 8331D.
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MG Chemicals 9410
Conductive adhesives
1K silver-filled epoxy, heat cure
Heat-curing conductive 1K epoxy for electrical contacts and EMI/RFI shielding.
View technical data →Elecolit
Elecolit 327
Conductive adhesives
1K modified polyimide, silver-filled (81 %), heat cure; electrically and thermally conductive
Silver conductive adhesive for high-temperature electrical contacts, with excellent adhesion to gold, aluminium, tantalum, germanium and ceramics, and very low ionic content.
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Elecolit 3025
Conductive adhesives
2K silver-filled epoxy, room-temperature/heat cure
Two-component silver conductive adhesive curing at room temperature, for heat-sensitive components; electrically and thermally conductive.
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Elecolit 3043
Conductive adhesives
1K epoxy, heat cure
Low-viscosity conductive adhesive with excellent flow for automotive sensors.
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Elecolit 3648
Conductive adhesives
1K epoxy, heat cure (snap cure / thermode)
Very flexible conductive adhesive for foil substrates (flex PCB, metal foils), organic photovoltaics and die attach; cures from 80 °C, snap cure or by thermode.
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Elecolit 3653
Conductive adhesives
1K epoxy, heat cure
Conductive adhesive for flexible substrates, powertrain and automotive sensors, vibration resistant and with high ionic purity.
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Elecolit 3655
Conductive adhesives
1K epoxy, heat cure
Conductive adhesive for SMD packaging and LED die attach, with high Tg and high ionic purity (semiconductor grade).
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Elecolit 3656
Conductive adhesives
1K epoxy, heat cure
Stable conductive adhesive with high dimensional stability, suitable for jetting, for SMD packaging and LED die attach.
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Elecolit 3661
Conductive adhesives
1K epoxy, heat cure
Stable, shape-retaining conductive adhesive for flexible circuits, flexible interconnect devices and die attach.
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Elecolit 3662
Conductive adhesives
1K epoxy, heat cure
Conductive adhesive for power modules with very good electrical conductivity, suitable for jetting and with low abrasiveness.
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Elecolit 323
Conductive adhesives
2K epoxy paste, heat cure
Biocompatible electrically and thermally conductive adhesive for medical devices, suitable for semiconductors and autoclavable.
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Elecolit 325
Conductive adhesives
2K epoxy paste, room-temperature/heat cure
Conductive adhesive for aeronautics, with minimal stringing and low volume resistivity even when cured at room temperature.
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Elecolit 336
Conductive adhesives
2K epoxy paste, room-temperature/heat cure
Conductive adhesive for medium-voltage protection/discharge and electronic contacting, with good conductivity when cured at room temperature.
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Elecolit 342
Conductive adhesives
1K acrylate, room-temperature/heat cure
Small-particle conductive adhesive for ESD protection and contacting heating elements.
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Elecolit 414
Conductive adhesives
1K polyester, heat cure
Flexible conductive adhesive with very high chemical resistance for aeronautics.
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MG Chemicals 8330S
Conductive adhesives
2K silver-filled epoxy, low outgassing
Very highly filled two-component silver epoxy adhesive with low outgassing per ASTM E595 (NASA); a reference for EMI shielding in space applications.
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MG Chemicals 8331S
Conductive adhesives
2K silver-filled epoxy, heat cure
Two-component silver epoxy adhesive with long working time and heat cure.
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