ElecolitThermal management
Elecolit 6601
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive/potting for bonding sensors and heat sinks, with excellent adhesion to metals, high strength and good flow.
Technical data
| Viscosity | 12.000–20.000 mPa·s |
|---|---|
| Thixotropic index | 1,3–1,5 |
| Thermal conductivity | 0,7–0,9 W/(m·K) |
| Cure | 5 min/150 °C; 70 min/100 °C |
Recommended for: Thermal management · Electronics protection
Need the technical data sheet (TDS) and safety data sheet (SDS)?
Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.
Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.