Momentive
Momentive SilCool TIA200R
Thermal management
1K thermally conductive silicone, heat cure
Heat-curing, thermally conductive 1K silicone adhesive.
View technical data →Thermal management
Momentive
Momentive SilCool TIA216G
Thermal management
2K thermally conductive silicone (encapsulant/TIM gel), addition cure
Thermally conductive 2K silicone encapsulant.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Tonsan 1535
Thermal management
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 1,8 W/mK, thermal encapsulation.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Tonsan 2532
Thermal management
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 0,8 W/mK, electronic TIM.
View technical data →Elecolit
Elecolit 6601
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive/potting for bonding sensors and heat sinks, with excellent adhesion to metals, high strength and good flow.
View technical data →Elecolit
Elecolit 6603
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive for sensors, heat sinks and magnets and automotive potting; highly resistant to vibration and thermal shock; UL94 HB.
View technical data →Elecolit
Elecolit 6604
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive for bonding magnets and heat sinks, with excellent adhesion to metals.
View technical data →Elecolit
Elecolit 6608
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
View technical data →MG Chemicals
MG Chemicals 8329TFF
Thermal management
2K thermally conductive epoxy, electrically insulating, flame-retardant
Very fast-setting fluid thermally conductive epoxy adhesive for bonding LED boards or battery modules to heat sinks; UL94 V-0 certified.
View technical data →MG Chemicals
MG Chemicals 8329TFS
Thermal management
2K thermally conductive epoxy
Thermally conductive epoxy adhesive with long working time.
View technical data →MG Chemicals
MG Chemicals 8349TFM
Thermal management
2K thermally conductive epoxy, flame-retardant
Fast-curing fluid thermally conductive epoxy adhesive for thermal management of processors and battery modules; meets UL94 V-0 per MG testing.
View technical data →MG Chemicals
MG Chemicals 8329TCM
Thermal management
2K thermally conductive epoxy paste
Thixotropic thermally conductive epoxy paste adhesive, suitable for vertical surfaces.
View technical data →MG Chemicals
MG Chemicals 8329TCS
Thermal management
2K thermally conductive epoxy paste, low outgassing
Long-working-time thermally conductive epoxy paste adhesive with low outgassing per ASTM E595, for thermal management in satellites.
View technical data →MG Chemicals
MG Chemicals 8329HTC
Thermal management
2K thermally conductive epoxy
Thermally conductive epoxy adhesive with a wide temperature range.
View technical data →MG Chemicals
MG Chemicals 9460TC
Thermal management
1K thermally conductive epoxy, electrically insulating
One-component thermally conductive epoxy paste adhesive, no mixing and unlimited working time; heat cure.
View technical data →MG Chemicals
MG Chemicals 495LV
Thermal management
Low-outgassing thermally conductive adhesive
Thermally conductive adhesive with low outgassing per ASTM E595, cited for bonding optical components.
View technical data →MG Chemicals
MG Chemicals TimCool 1.4
Thermal management
Thermally conductive material (chemistry not stated)
New heat dissipation product announced in the battery guide.
View technical data →MG Chemicals
MG Chemicals TimCool 2.5
Thermal management
Thermally conductive material (chemistry not stated)
New heat dissipation product announced in the battery guide.
View technical data →MG Chemicals
MG Chemicals 860
Thermal management
Silicone thermal paste
One-component silicone thermal paste that does not bond permanently, allowing rework.
View technical data →MG Chemicals
MG Chemicals 8616
Thermal management
Silicone-free thermal paste
One-component silicone-free oil-based thermal paste.
View technical data →MG Chemicals
MG Chemicals 8617A
Thermal management
Silicone-free thermal paste
High-conductivity silicone-free thermal paste, also proposed as a gap filler in batteries.
View technical data →MG Chemicals
MG Chemicals 8618
Thermal management
Silicone-free thermal paste
Very high conductivity silicone-free thermal paste.
View technical data →MG Chemicals
MG Chemicals TIA225GF
Thermal management
2K silicone gap filler
High-conductivity two-component silicone gap filler that cures to a putty consistency and conforms to the gap between component and cold plate.
View technical data →MG Chemicals
MG Chemicals TIA241GF
Thermal management
2K silicone gap filler
Two-component silicone gap filler with extreme thermal conductivity.
View technical data →MG Chemicals
MG Chemicals 8327GL3
Thermal management
1K silicone-free thermal gel, non-curing
One-component silicone-free thermally conductive gel for form-in-place application; non-curing, low modulus, reworkable and UL94 V-0.
View technical data →MG Chemicals
MG Chemicals 8327GL5
Thermal management
1K silicone-free thermal gel, non-curing
One-component silicone-free form-in-place thermally conductive gel, high conductivity and UL94 V-0.
View technical data →MG Chemicals
MG Chemicals 8327GL6
Thermal management
1K silicone-free thermal gel, non-curing
One-component silicone-free form-in-place thermally conductive gel, very high conductivity and UL94 V-0.
View technical data →Momentive
Momentive TSE3280G
Thermal management
1K thermally conductive silicone, heat cure
Heat-curing grey thermally conductive silicone adhesive for heat dissipation in electronics.
View technical data →Momentive
Momentive TSE3281G
Thermal management
1K thermally conductive silicone, heat cure
Grey thermally conductive silicone adhesive with higher conductivity and hardness for thermal interfaces in electronics.
View technical data →SilCool
Momentive TIA250RZ
Thermal management
1K thermally conductive silicone, heat cure
Heat-curing grey thermally conductive paste adhesive, adhering to metals and engineering plastics.
View technical data →SilCool
Momentive TIS420C
Thermal management
1K silicone gap filler, moisture cure to gel
Grey thixotropic high-conductivity one-component thermal gap filler that moisture-cures to a gel.
View technical data →Momentive
Momentive TIA2101GF
Thermal management
2K system (component A with aluminium nitride) — type not documented in TDS
System for which only the Spanish SDS of component A exists, filled with aluminium nitride; no TDS describing its use.
View technical data →