MG ChemicalsThermal management
MG Chemicals 8349TFM
2K thermally conductive epoxy, flame-retardant
Fast-curing fluid thermally conductive epoxy adhesive for thermal management of processors and battery modules; meets UL94 V-0 per MG testing.
Technical data
| Thermal conductivity | 1,1 W/(m·K) |
|---|---|
| Working time | 20 min |
| Mix ratio | 1:1 by volume |
| Cure | 260 min at 22 °C, 20 min at 65 °C or 10 min at 80 °C |
| Service temperature | −50 a 150 °C |
| Hardness / Tg | 92D / 80 °C |
| Approvals | cumple UL94 V-0 (no reconocido por UL) |
Recommended for: Thermal management
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