MomentiveThermal management
Momentive TSE3281G
1K thermally conductive silicone, heat cure
Grey thermally conductive silicone adhesive with higher conductivity and hardness for thermal interfaces in electronics.
Technical data
| Viscosity | 60 Pa·s |
|---|---|
| Cure | 100 °C/4 h; 125 °C/2 h; 150 °C/1 h (TDS 2016) |
| Thermal conductivity | 1,68 W/m·K |
| Hardness | Shore A 84 |
| Tensile strength | 4,5 MPa |
| Elongation | 50 % |
| Adhesion | 2,5 MPa |
| Density | 2,70 |
Recommended for: Thermal management
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.