SilCoolThermal management
Momentive TIA250RZ
1K thermally conductive silicone, heat cure
Heat-curing grey thermally conductive paste adhesive, adhering to metals and engineering plastics.
Technical data
| Viscosity | 40 Pa·s |
|---|---|
| Cure | 120 °C/30 min |
| Thermal conductivity | 2,2 W/m·K |
| Thermal resistance | 38 mm²·K/W (50 µm) |
| Hardness | Shore A 84 |
| Tensile strength | 4,8 MPa |
| Adhesion Al | 3,0 MPa |
| Dielectric strength | 20 kV/mm |
Recommended for: Thermal management
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.