SilCoolThermal management
Momentive TIS420C
1K silicone gap filler, moisture cure to gel
Grey thixotropic high-conductivity one-component thermal gap filler that moisture-cures to a gel.
Technical data
| Viscosity | 300 Pa·s |
|---|---|
| Skin time | 5 min |
| Cure | 2 days at 23 °C/50 % HR |
| Thermal conductivity | 4,2 W/m·K |
| Thermal resistance | 20 mm²·K/W (50 µm) |
| Dielectric strength | 5,0 kV/0,25 mm |
| Density | 3,20 |
| Pack size | Cartridge 333 ml |
Recommended for: Thermal management
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.