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Momentive SilCool TIA200R

1K thermally conductive silicone, heat cure

Heat-curing, thermally conductive 1K silicone adhesive.

Technical data
ColourGrey
Viscosity70 Pa·s
Cure30 min at 120 °C
Thermal conductivity2,0 W/m·K (hilo caliente)
HardnessShore A 85
Shear strength3,0 MPa
Dielectric strength20 kV/mm
Storage<5 °C; atemperar antes de abrir

Recommended for: Thermal management

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