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Momentive SilCool TIA216G

2K thermally conductive silicone (encapsulant/TIM gel), addition cure

Thermally conductive 2K silicone encapsulant.

Technical data
Mix ratio A:B1:1 by weight and volume
ViscosityA 9,5 Pa·s; B 6,6 Pa·s
Pot life2 h a 23 °C
Cure6 h at ambient or 0,5 h at 70 °C
Thermal conductivity1,6 W/m·K
HardnessShore E 40
Dielectric strength20 kV/mm
FlammabilityUL94 V-0 E56745 (stated)

Recommended for: Thermal management

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