StructalitEpoxy for electronics
Structalit 5894 M
1K epoxy, heat cure
Black fill material for PCB encapsulation (e.g. level sensors) and frame & fill, with very high chemical, thermal and shock resistance.
Technical data
| Viscosity | 20.000–30.000 mPa·s (Rheometer 20 s⁻¹) |
|---|---|
| Cure | 5 min/150 °C; 60 min/100 °C |
| Colour | Black |
Recommended for: Electronics protection
Need the technical data sheet (TDS) and safety data sheet (SDS)?
Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.
Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.