MG Chemicals
Epoxy potting resins for protecting electronics; the technician picks the reference for each case.
Viamonte will tell you the exact 832 series reference for your application.
View technical data →Hoenle Eleco
1K modified epoxy, solvent-free, heat cure
Heat-curing 1K epoxy for chip underfill, capillary flow and fast cure.
View technical data →Bacon / Fiber Resin (H.B. Fuller Aerospace)
Aerospace epoxy
Aerospace epoxy from the Bacon/Fuller range: electrical potting 0.23 W/mK, surface-mount, anti-vibration, resistant to salt water and Fuel C.
View technical data →Structalit
1K modified epoxy with quartz filler (65 %), heat cure
High-Tg, low-CTE underfill with good flow at elevated temperature, for protecting joints under components.
View technical data →Structalit
2K epoxy, room-temperature/heat cure
Two-component epoxy for capacitor bonding, corner bonding and general structural bonding, with very good dielectric properties.
View technical data →Structalit
1K epoxy, heat cure
Beige one-component epoxy with short low-temperature cure for structural bonding, magnets, glob top and sensor potting; highly resistant to oils, greases and media, low outgassing and low ionic content; ISO 10993-5.
View technical data →Structalit
1K epoxy, heat cure
Glob top with fast low-temperature cure, excellent shock resistance and very high chemical resistance.
View technical data →Structalit
1K epoxy, heat cure
Stable black frame material for frame & fill, applicable wet-on-wet and in several layers, with very high shock resistance.
View technical data →Structalit
1K epoxy, heat cure
Black fill material for PCB encapsulation (e.g. level sensors) and frame & fill, with very high chemical, thermal and shock resistance.
View technical data →Structalit
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
View technical data →Structalit
1K epoxy, heat cure
Fast-curing red SMD adhesive, resistant to soldering temperatures, for protecting and fixing components.
View technical data →Structalit
Epoxy, heat cure, fluorescent
Fast, low-temperature curing SMD adhesive, easy to dispense, screen-printable and suitable for pin transfer.
View technical data →Structalit
1K epoxy, heat cure
Stable high-Tg black epoxy as the frame in frame & fill with the Structalit 5717/5719/5720 fills and for edge bonding; no bleeding and very low ionic content, suitable for semiconductors.
View technical data →Structalit
Epoxy, heat cure
Fill material for frame & fill in semiconductors, with very good flow, high Tg and no bleeding.
View technical data →Structalit
1K epoxy, heat cure
High-Tg fill material for frame & fill, with very good flow and no bleeding.
View technical data →Structalit
Epoxy, heat cure
Black frame material for frame & fill, resistant to vibration and impact and with low ionic content.
View technical data →Structalit
1K epoxy, heat cure
Black epoxy with fast low-temperature cure and good shock resistance, for medical disposables and as fill in frame & fill; ISO 10993-5.
View technical data →Structalit
2K epoxy, room-temperature/heat cure
Two-component epoxy for PCB potting with high resistance to grease, oil, chemicals and moisture, low shrinkage and high adhesion to metal, glass and plastic.
View technical data →Structalit
2K epoxy, heat/room-temperature cure
Clear low-viscosity two-component epoxy for PCB potting, resistant to moisture and chemicals.
View technical data →Structalit
1K epoxy, heat cure
Low-Tg flexible epoxy curing at low temperature for potting sensitive components and glob top; jettable, flux-compatible and resistant to temperature and humidity changes.
View technical data →Structalit
Epoxy, heat cure
Highly flexible, stress-compensating, low-outgassing epoxy for LBA and lens bonding in automotive optical sensors.
View technical data →Structalit
Epoxy, heat cure
Connector bonding adhesive with low ionic content, high modulus and high elongation, resistant to vibration and shock, with excellent adhesion to LCP and PBT.
View technical data →Structalit
Epoxy, heat cure
Low-modulus flexible adhesive for connectors with excellent adhesion to LCP and PBT, suited to temperature-sensitive substrates (cures from 60 °C).
View technical data →Structalit
Epoxy, heat cure
Low-CTE adhesive for connectors with excellent adhesion to LCP and PBT, resistant to chemicals and vibration, for temperature-sensitive substrates.
View technical data →MG Chemicals
2K potting epoxy
Low-permittivity two-component epoxy potting compound for charger receivers, controllers and wiring harnesses.
View technical data →MG Chemicals
2K potting epoxy
Low-permittivity two-component epoxy potting compound for receivers, controllers and wiring harnesses.
View technical data →MG Chemicals
Rigid 2K potting epoxy
General-purpose epoxy encapsulant that cures rigid; used to give IP68 to junction boxes of flowmeters and submersible sensors.
View technical data →MG Chemicals
Optically clear 2K potting epoxy
Clear epoxy resin that cures rigid, submersible in water; allows visual inspection of components and protects LED domes against impact.
View technical data →MG Chemicals
2K potting epoxy
Two-component epoxy potting compound from the 832 series.
View technical data →MG Chemicals
Flexible 2K potting epoxy
Black flexible epoxy encapsulant for protecting LED drivers.
View technical data →MG Chemicals
2K thermally conductive potting epoxy
Thermally conductive (non-flame-retardant) potting epoxy for LED drivers and strips and battery modules.
View technical data →MG Chemicals
1K potting epoxy
One-component epoxy potting compound.
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid, thermally conductive, flame-retardant epoxy encapsulant (non-halogenated fillers) for batteries, LED drivers and electronics with fire risk.
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid thermally conductive, flame-retardant epoxy encapsulant, UL94 V-0 certified, for LED drivers and battery packs.
View technical data →MG Chemicals
Flexible flame-retardant 2K potting epoxy
Flame-retardant flexible epoxy encapsulant for aggressive thermal cycling.
View technical data →MG Chemicals
Flame-retardant 2K potting epoxy
Flame-retardant epoxy potting compound from the 834 series.
View technical data →Your privacy, your choice
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