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Structalit 5704

1K epoxy, heat cure

Stable high-Tg black epoxy as the frame in frame & fill with the Structalit 5717/5719/5720 fills and for edge bonding; no bleeding and very low ionic content, suitable for semiconductors.

Technical data
Viscosity60.000–100.000 mPa·s (Rheometer 10 s⁻¹)
Cure15 min/150 °C; 45 min/120 °C
Service temperature−40 a +200 °C
HardnessShore D 75–90
Ionic content<10 ppm
ColourBlack

Recommended for: Electronics protection

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