StructalitEpoxy for electronics
Structalit 5717
Epoxy, heat cure
Fill material for frame & fill in semiconductors, with very good flow, high Tg and no bleeding.
Technical data
| Viscosity | 3.000–8.000 mPa·s (Rheometer 5 s⁻¹) |
|---|---|
| Cure | 30 min/120 °C + 30 min/150 °C |
Recommended for: Electronics protection
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