StructalitEpoxy for electronics
Structalit 5512
Epoxy, heat cure
Connector bonding adhesive with low ionic content, high modulus and high elongation, resistant to vibration and shock, with excellent adhesion to LCP and PBT.
Technical data
| Viscosity | 9.500 mPa·s (Rheometer 10 s⁻¹) |
|---|---|
| Cure | 10 min/120 °C; 25 min/80 °C |
| Service temperature | −40 a +150 °C |
| Hardness | Shore D 65 |
Recommended for: Electronics protection · Structural bonding
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.