StructalitEpoxy for electronics
Structalit 5521
Epoxy, heat cure
Low-modulus flexible adhesive for connectors with excellent adhesion to LCP and PBT, suited to temperature-sensitive substrates (cures from 60 °C).
Technical data
| Viscosity | 1.200–2.000 mPa·s (Rheometer 10 s⁻¹) |
|---|---|
| Cure | 10 min/120 °C; 40 min/60 °C |
| Service temperature | −40 a +150 °C |
| Hardness | Shore D 60–80 |
Recommended for: Electronics protection · Structural bonding
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.