StructalitEpoxy for electronics
Structalit 5531
Epoxy, heat cure
Low-CTE adhesive for connectors with excellent adhesion to LCP and PBT, resistant to chemicals and vibration, for temperature-sensitive substrates.
Technical data
| Viscosity | 5.000–10.000 mPa·s (Rheometer 10 s⁻¹) |
|---|---|
| Cure | 5 min/150 °C; 40 min/60 °C |
| Service temperature | −40 a +180 °C |
| Hardness | Shore D 55–70 |
Recommended for: Electronics protection · Structural bonding
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.