Hoenle ElecoEpoxy for electronics
Structalit 8202
1K modified epoxy, solvent-free, heat cure
Heat-curing 1K epoxy for chip underfill, capillary flow and fast cure.
Technical data
| Viscosity | 300–400 mPa·s (Kinexus, 25 °C, 10 s⁻¹) |
|---|---|
| Cure | 130 °C/10 min or 150 °C/5 min (P067) |
| Service temperature | −40 a +200 °C |
| Tg (DSC) | 85–100 °C |
| CTE < Tg | 30–60 ppm/K |
| Tensile / elongation | 40–50 MPa / <5 % |
| Hardness | Shore D 65–85 |
| Storage | Transport 0–10 °C, storage −20 °C; ≥3 months on delivery, max. 6 |
Recommended for: Electronics protection
Need the technical data sheet (TDS) and safety data sheet (SDS)?
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.