Tonsan / Bacon (H.B. Fuller Aerospace)
Tonsan 1587
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: replaces preformed gaskets, high T°.
View technical data →Adhesives, sealants and surface preparation products for Electronics, organised by application. We only list a product when its documentation covers that use.
Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: replaces preformed gaskets, high T°.
View technical data →Vitralit
Blue fluorescent 1K polyacrylate, UV/LED-UV cure; cured-in-place gasket (CIPG)
Cured-in-place liquid gasket for automotive electronics housings (ECU, BDU, OBC…), with low compression set, resistance to engine oil, ATF and brake fluid, and reusable after disassembly (MRO). Replaces solid gaskets and RTV silicone FIPG.
View technical data →Kömmerling
Solvent-free 2K polyurethane, cures at room T° regardless of humidity
Very low viscosity version of Körapur 672 for potting; proposed for potting/coating heat exchangers.
View technical data →Kömmerling
Fast-curing 2K epoxy
Fast-curing 2K epoxy for glass, ceramics, stone, metal and electronics.
View technical data →Structalit
1K epoxy, heat cure
Beige one-component epoxy with short low-temperature cure for structural bonding, magnets, glob top and sensor potting; highly resistant to oils, greases and media, low outgassing and low ionic content; ISO 10993-5.
View technical data →Structalit
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
View technical data →Structalit
Epoxy, heat cure
Highly flexible, stress-compensating, low-outgassing epoxy for LBA and lens bonding in automotive optical sensors.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: interior/exterior bonding.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: sealing of solar junction boxes and solar lamps.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: electronic glass/plastic/metal bonding.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: seam sealing, general assembly.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: reworkable applications, neutral, low/no odor.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, white, paste. Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, black, paste. Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, red, high-temperature paste. Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, translucent, paste. Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, aluminium, paste. Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, white, self-levelling (200 P). Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, red, high-temperature self-levelling (250 P). Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K acetoxy RTV silicone, moisture cure
One-component acetoxy RTV silicone from the RTV100 series, translucent, self-levelling (200 P). Primerless adhesion to metals, glass, ceramics, silicone rubber and some rigid plastics; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, moisture cure
Black, thixotropic, low-flammability silicone sealant-adhesive for electronics, aerospace and equipment. Neutral cure releasing alcohol; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility
White, non-corrosive, low-outgassing paste adhesive-sealant for electronics joints on vertical/overhead surfaces. Neutral cure releasing methanol; primers SS4004P/SS4044P/SS4179 on difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White fluid neutral-cure silicone sealant, non-corrosive on copper/brass, for insulating and protecting PCBs and connections. Primers SS4004/SS4044/SS4179 on difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White neutral-cure silicone paste sealant, non-corrosive, for electronics and protecting connections. Primers SS4004/SS4044/SS4179 recommended on difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, high-strength electronic grade
High-strength grey neutral-cure silicone paste sealant, non-corrosive on Cu/brass, for electronics. Primers SS4004/SS4044/SS4179 on difficult substrates.
View technical data →SnapSil
1K acetoxy fluorosilicone, moisture cure
Red fluorosilicone paste resistant to fuels and hydrocarbon solvents, for tank seals and sensors. Primerless adhesion to many substrates.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, moisture cure
Neutral-cure silicone adhesive-sealant for sealing and fixing in electronics, with primerless adhesion to metals, copper, plastics and glass and slight thermal conductivity.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility
Low-volatility neutral-cure silicone sealant for sealing electrical components, with primerless adhesion to many substrates.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility, flowable
Fluid neutral-cure, low-volatile silicone sealant for sealing electronics, with primerless adhesion.
View technical data →Momentive
1K neutral RTV silicone, moisture cure
Translucent silicone paste sealant for electronics and high-performance plastics, with primerless adhesion to polycarbonate and non-corrosive on copper.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White neutral-cure electronic silicone (RTV5240 series) for sensitive metals, plastics and painted surfaces.
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, thixotropic
Thixotropic neutral-cure silicone, non-corrosive to metals, for electrical/electronic insulation and moisture protection; primerless adhesion to many plastics.
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, semi-flowable
Semi-fluid, non-corrosive neutral-cure silicone for electrical/electronic insulation and moisture protection.
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, flowable
Fluid, non-corrosive neutral-cure silicone for electrical/electronic insulation and thin-layer moisture protection.
View technical data →Momentive
2K alkoxy RTV silicone, fast cure, thixotropic
Thixotropic two-component silicone system with fast room-temperature cure (RTV210A + hardener RTV224B black or RTV229B grey), for automotive headlamps, solar panels and electronics.
View technical data →Novasil
2K alkoxy condensation silicone
Industrial two-component adhesive-sealant with primerless adhesion even in the presence of water, for photovoltaics, electronics and home appliances.
View technical data →Novasil
1K neutral alkoxy silicone
Clear 1K silicone with good adhesion to glass and plastics and resistance to temperature and UV.
View technical data →Novasil
1K neutral alkoxy silicone
Soft silicone for elastic bonding and sealing of acrylic and polycarbonate, also in electronics.
View technical data →OTTOSEAL
1K neutral silicone
Neutral silicone for electronic/pharmaceutical production cleanrooms and ventilation.
View technical data →Kömmerling
Solvent-free 2K polyurethane, cures at room T° regardless of humidity
Very low viscosity version of Körapur 672 for potting; proposed for potting/coating heat exchangers.
View technical data →Bacon / Fiber Resin (H.B. Fuller Aerospace)
Aerospace epoxy
Aerospace epoxy from the Bacon/Fuller range: electrical potting 0.23 W/mK, surface-mount, anti-vibration, resistant to salt water and Fuel C.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 0,30 W/mK, electrical potting.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 0,30 W/mK, inverter/solar potting.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 1,8 W/mK, thermal encapsulation.
View technical data →Structalit
1K modified epoxy with quartz filler (65 %), heat cure
High-Tg, low-CTE underfill with good flow at elevated temperature, for protecting joints under components.
View technical data →Vitralit
1K acrylate, UV/VIS cure
Highly thixotropic UV adhesive for cell block spacers in batteries and SMD protection; hard, dry surface, low shrinkage and good adhesion to FR4.
View technical data →Vitralit
1K epoxy, UV + heat cure
UV/thermal encapsulant for soldered joints and connector solder points and for flexible conductors, with high adhesion to polyimide and low halogen content.
View technical data →Vitralit
1K acrylate-isocyanate, UV/VIS + moisture cure
UV adhesive/glob top with moisture post-cure, jettable, for encapsulating welds in cell contacting systems and glob tops; flux-compatible and low in halogens.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure, fluorescent
Fluorescent potting material, easy to dispense and fast curing, flux-compatible and pseudoplastic.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
High-Tg adhesive with deep cure and moisture post-cure for batteries and connector bonding; flux-compatible and low ionic content.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
Connector bonding adhesive that passes UL94 HB, high Tg, fast cure, flux-compatible and low ionic content.
View technical data →Vitralit
1K epoxy, UV cure, Black & Light technology
Thick-layer UV-curable black adhesive (Black & Light) for encapsulation, light shielding and lens bonding; low shrinkage.
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
View technical data →Vitralit
Acrylate, UV/VIS cure (+ heat according to the Automotive brochure), fluorescent
Soft elastic coating for flexible circuits (FPCB) and conformal coating, fast curing with a dry, tack-free surface.
View technical data →Vitralit
Acrylate, UV/VIS cure
Dry-surface, flexible, tear-resistant UV adhesive with good resistance to moisture and thermal cycling, for edge bonding and glass/plastic bonding; CMR-free.
View technical data →Structalit
1K epoxy, heat cure
Beige one-component epoxy with short low-temperature cure for structural bonding, magnets, glob top and sensor potting; highly resistant to oils, greases and media, low outgassing and low ionic content; ISO 10993-5.
View technical data →Structalit
1K epoxy, heat cure
Stable black frame material for frame & fill, applicable wet-on-wet and in several layers, with very high shock resistance.
View technical data →Structalit
1K epoxy, heat cure
Black fill material for PCB encapsulation (e.g. level sensors) and frame & fill, with very high chemical, thermal and shock resistance.
View technical data →Structalit
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
View technical data →Structalit
1K epoxy, heat cure
Fast-curing red SMD adhesive, resistant to soldering temperatures, for protecting and fixing components.
View technical data →Structalit
Epoxy, heat cure, fluorescent
Fast, low-temperature curing SMD adhesive, easy to dispense, screen-printable and suitable for pin transfer.
View technical data →Structalit
1K epoxy, heat cure
Stable high-Tg black epoxy as the frame in frame & fill with the Structalit 5717/5719/5720 fills and for edge bonding; no bleeding and very low ionic content, suitable for semiconductors.
View technical data →Structalit
2K epoxy, room-temperature/heat cure
Two-component epoxy for PCB potting with high resistance to grease, oil, chemicals and moisture, low shrinkage and high adhesion to metal, glass and plastic.
View technical data →Structalit
2K epoxy, heat/room-temperature cure
Clear low-viscosity two-component epoxy for PCB potting, resistant to moisture and chemicals.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive/potting for bonding sensors and heat sinks, with excellent adhesion to metals, high strength and good flow.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
View technical data →MG Chemicals
Rigid 2K potting epoxy
General-purpose epoxy encapsulant that cures rigid; used to give IP68 to junction boxes of flowmeters and submersible sensors.
View technical data →MG Chemicals
2K thermally conductive potting epoxy
Thermally conductive (non-flame-retardant) potting epoxy for LED drivers and strips and battery modules.
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid, thermally conductive, flame-retardant epoxy encapsulant (non-halogenated fillers) for batteries, LED drivers and electronics with fire risk.
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid thermally conductive, flame-retardant epoxy encapsulant, UL94 V-0 certified, for LED drivers and battery packs.
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →MG Chemicals
RTV potting silicone
Low-modulus RTV potting silicone, suitable for delicate SMD components and a wide temperature range (family data).
View technical data →MG Chemicals
Clear RTV potting silicone
Clear RTV potting silicone that cushions impacts and protects LEDs against photo-oxidation.
View technical data →MG Chemicals
Clear 1K insulating varnish (acrylic, modified alkyd)
Clear insulating varnish with high dielectric strength for coils, windings and PCBs; low VOC and HAP-free.
View technical data →MG Chemicals
1K dielectric coating (acrylic, modified alkyd)
Dielectric coating for high-voltage insulation with class H insulation up to 180 °C per UL EIS.
View technical data →MG Chemicals
Red 1K insulating varnish (acrylic, modified alkyd)
Red insulating varnish with high dielectric strength, liquid and aerosol; low VOC and HAP-free.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, moisture cure
Black, thixotropic, low-flammability silicone sealant-adhesive for electronics, aerospace and equipment. Neutral cure releasing alcohol; primers SS4004/SS4044/SS4179 for difficult substrates.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility
White, non-corrosive, low-outgassing paste adhesive-sealant for electronics joints on vertical/overhead surfaces. Neutral cure releasing methanol; primers SS4004P/SS4044P/SS4179 on difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White fluid neutral-cure silicone sealant, non-corrosive on copper/brass, for insulating and protecting PCBs and connections. Primers SS4004/SS4044/SS4179 on difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White neutral-cure silicone paste sealant, non-corrosive, for electronics and protecting connections. Primers SS4004/SS4044/SS4179 recommended on difficult substrates.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, high-strength electronic grade
High-strength grey neutral-cure silicone paste sealant, non-corrosive on Cu/brass, for electronics. Primers SS4004/SS4044/SS4179 on difficult substrates.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, moisture cure
Neutral-cure silicone adhesive-sealant for sealing and fixing in electronics, with primerless adhesion to metals, copper, plastics and glass and slight thermal conductivity.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility
Low-volatility neutral-cure silicone sealant for sealing electrical components, with primerless adhesion to many substrates.
View technical data →SnapSil
1K alkoxy (neutral) RTV silicone, low volatility, flowable
Fluid neutral-cure, low-volatile silicone sealant for sealing electronics, with primerless adhesion.
View technical data →Momentive
1K neutral RTV silicone, moisture cure
Translucent silicone paste sealant for electronics and high-performance plastics, with primerless adhesion to polycarbonate and non-corrosive on copper.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White neutral-cure electronic silicone (RTV5240 series) for sensitive metals, plastics and painted surfaces.
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, thixotropic
Thixotropic neutral-cure silicone, non-corrosive to metals, for electrical/electronic insulation and moisture protection; primerless adhesion to many plastics.
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, semi-flowable
Semi-fluid, non-corrosive neutral-cure silicone for electrical/electronic insulation and moisture protection.
View technical data →Momentive
1K alkoxy RTV silicone, moisture cure, flowable
Fluid, non-corrosive neutral-cure silicone for electrical/electronic insulation and thin-layer moisture protection.
View technical data →SilTrust
2K addition-cure silicone, heat cure, thermally conductive
Black 1:1 two-component heat-curing silicone encapsulant, self-extinguishing and slightly thermally conductive, for electrical and motor potting.
View technical data →Silopren
2K addition-cure silicone gel, clear
Solvent-free 1:1 clear silicone gel for potting modules, cable joints and electronics; room-temperature or heat-accelerated cure.
View technical data →Momentive
Clear 2K addition-cure silicone, low viscosity
10:1 two-component potting silicone, a different formulation from RTV615, flexible down to −115 °C.
View technical data →Momentive
2K addition-cure silicone
10:1 two-component potting silicone, different from RTV615 and RTV655, with electrical/optical properties and bulk cure.
View technical data →Momentive
Silicone dielectric gel (RTV6100 series)
Dielectric gel cited in the master file for protecting delicate electronics in harsh environments and damping shock and vibration.
View technical data →Momentive
Silicone dielectric gel (RTV6100 series)
Dielectric gel cited in the master file for protecting delicate electronics in harsh environments and damping shock and vibration.
View technical data →Momentive
2K condensation RTV silicone, high temperature
Fluid red high-temperature silicone elastomer for potting motors and transformers; requires primer to adhere to non-silicone surfaces.
View technical data →SilTrust
2K condensation RTV silicone
White two-component silicone for electrical and aerospace potting; primer SS4004P on non-silicone surfaces.
View technical data →SilTrust
2K condensation RTV silicone
White two-component silicone for electronic/aerospace potting; primer SS4004P on non-silicone surfaces.
View technical data →SilTrust
2K condensation RTV silicone, high temperature
Red two-component silicone for potting modules, connectors and coils at high temperature.
View technical data →Novasil
1K neutral alkoxy silicone
Clear 1K silicone with good adhesion to glass and plastics and resistance to temperature and UV.
View technical data →MG Chemicals
Epoxy potting resins for protecting electronics; the technician picks the reference for each case.
Viamonte will tell you the exact 832 series reference for your application.
View technical data →Hoenle Eleco
Highly filled 1K modified acrylate (glass 35 %), UV/visible cure
Highly filled, low-shrinkage UV acrylate for bonding and sealing plastics, glass and metal and protecting components.
View technical data →Hoenle Eleco
1K modified acrylate-isocyanate, UV/visible cure with secondary moisture cure in shadow areas
UV-curing acrylate with secondary moisture cure for encapsulating components on boards.
View technical data →Hoenle Eleco
1K modified acrylate, UV/visible cure, optically clear
Optically clear, soft UV-cure encapsulation gel; an alternative to silicone.
View technical data →Momentive
2K addition-cure silicone gel
2K silicone gel for encapsulating and protecting delicate electronics.
View technical data →Momentive
Low-outgassing 2K RTV silicone
Low-outgassing 2K silicone for optics, aerospace and sensitive electronics.
View technical data →Vitralit
Blue fluorescent 1K polyacrylate, UV/LED-UV cure; cured-in-place gasket (CIPG)
Cured-in-place liquid gasket for automotive electronics housings (ECU, BDU, OBC…), with low compression set, resistance to engine oil, ATF and brake fluid, and reusable after disassembly (MRO). Replaces solid gaskets and RTV silicone FIPG.
View technical data →Vitralit
1K acrylate, UV/VIS cure
Highly thixotropic UV adhesive for cell block spacers in batteries and SMD protection; hard, dry surface, low shrinkage and good adhesion to FR4.
View technical data →Vitralit
1K acrylate-isocyanate, UV/VIS + moisture cure
UV adhesive/glob top with moisture post-cure, jettable, for encapsulating welds in cell contacting systems and glob tops; flux-compatible and low in halogens.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
High-Tg adhesive with deep cure and moisture post-cure for batteries and connector bonding; flux-compatible and low ionic content.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
Connector bonding adhesive that passes UL94 HB, high Tg, fast cure, flux-compatible and low ionic content.
View technical data →Vitralit
1K epoxy, UV cure, Black & Light technology
Thick-layer UV-curable black adhesive (Black & Light) for encapsulation, light shielding and lens bonding; low shrinkage.
View technical data →Vitralit
Acrylate/epoxy, UV + heat cure
Flexible, fast light-fixing, low-outgassing adhesive for bonding lenses with shadow areas (cameras/ADAS).
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
View technical data →Vitralit
Acrylate, UV/VIS cure
Low-shrinkage flexible adhesive for active alignment and optoelectronics, impact resistant with a dry surface.
View technical data →Vitralit
1K epoxy, UV/VIS cure
Adhesive for active alignment and optoelectronics with low outgassing, low shrinkage and low CTE.
View technical data →Vitralit
Acrylate, UV/VIS cure
Low-shrinkage, low-expansion UV adhesive for optoelectronics, hard dry surface, fast cure and moisture resistant.
View technical data →Vitralit
Acrylate, UV/VIS cure
Flexible UV adhesive with a dry surface and excellent adhesion to glass and plastics, for medical devices (ISO 10993-5) and luxury packaging.
View technical data →Vitralit
Acrylate, UV/VIS cure
Dry-surface, flexible, tear-resistant UV adhesive with good resistance to moisture and thermal cycling, for edge bonding and glass/plastic bonding; CMR-free.
View technical data →Vitralit
Acrylate, UV/VIS cure
Soft, flexible adhesive with dry-surface cure and excellent thermal-cycling resistance, for tubing sets, breathing circuits or coating electronic devices; ISO 10993-5.
View technical data →Vitralit
UV/VIS + moisture cure
Adhesive for flexible electronics with high adhesion to various substrates, UV fixing and moisture post-cure in shadow areas.
View technical data →Vitralit
UV/VIS + heat cure, fluorescent
Fluorescent adhesive for flexible electronics with high adhesion to various substrates, UV fixing and thermal post-cure in shadow areas.
View technical data →Hoenle Eleco
Highly filled 1K modified acrylate (glass 35 %), UV/visible cure
Highly filled, low-shrinkage UV acrylate for bonding and sealing plastics, glass and metal and protecting components.
View technical data →Hoenle Eleco
1K modified acrylate-isocyanate, UV/visible cure with secondary moisture cure in shadow areas
UV-curing acrylate with secondary moisture cure for encapsulating components on boards.
View technical data →Hoenle Eleco
1K modified acrylate, UV/visible cure, optically clear
Optically clear, soft UV-cure encapsulation gel; an alternative to silicone.
View technical data →Elecolit
2K silver-filled epoxy, room-temperature/heat cure
Two-component silver conductive adhesive curing at room temperature, for heat-sensitive components; electrically and thermally conductive.
View technical data →Elecolit
1K epoxy, heat cure
Low-viscosity conductive adhesive with excellent flow for automotive sensors.
View technical data →Elecolit
1K epoxy, heat cure (snap cure / thermode)
Very flexible conductive adhesive for foil substrates (flex PCB, metal foils), organic photovoltaics and die attach; cures from 80 °C, snap cure or by thermode.
View technical data →Elecolit
1K epoxy, heat cure
Conductive adhesive for flexible substrates, powertrain and automotive sensors, vibration resistant and with high ionic purity.
View technical data →Elecolit
1K epoxy, heat cure
Conductive adhesive for SMD packaging and LED die attach, with high Tg and high ionic purity (semiconductor grade).
View technical data →Elecolit
1K epoxy, heat cure
Stable conductive adhesive with high dimensional stability, suitable for jetting, for SMD packaging and LED die attach.
View technical data →Elecolit
2K epoxy paste, room-temperature/heat cure
Conductive adhesive for medium-voltage protection/discharge and electronic contacting, with good conductivity when cured at room temperature.
View technical data →MG Chemicals
Nickel-filled acrylic conductive pen
Nickel conductive pen for moderate-conductivity repairs such as PCB bridges and tracks.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 1,8 W/mK, thermal encapsulation.
View technical data →Tonsan / Bacon (H.B. Fuller Aerospace)
Silicone for electronics (aerospace electronics)
Tonsan/Bacon silicone: 0,8 W/mK, electronic TIM.
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
View technical data →Elecolit
2K silver-filled epoxy, room-temperature/heat cure
Two-component silver conductive adhesive curing at room temperature, for heat-sensitive components; electrically and thermally conductive.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive/potting for bonding sensors and heat sinks, with excellent adhesion to metals, high strength and good flow.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive for sensors, heat sinks and magnets and automotive potting; highly resistant to vibration and thermal shock; UL94 HB.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
View technical data →MG Chemicals
2K thermally conductive epoxy, electrically insulating, flame-retardant
Very fast-setting fluid thermally conductive epoxy adhesive for bonding LED boards or battery modules to heat sinks; UL94 V-0 certified.
View technical data →MG Chemicals
2K thermally conductive epoxy, flame-retardant
Fast-curing fluid thermally conductive epoxy adhesive for thermal management of processors and battery modules; meets UL94 V-0 per MG testing.
View technical data →MG Chemicals
2K thermally conductive epoxy paste, low outgassing
Long-working-time thermally conductive epoxy paste adhesive with low outgassing per ASTM E595, for thermal management in satellites.
View technical data →MG Chemicals
2K thermally conductive epoxy
Thermally conductive epoxy adhesive with a wide temperature range.
View technical data →MG Chemicals
Thermally conductive material (chemistry not stated)
New heat dissipation product announced in the battery guide.
View technical data →MG Chemicals
Thermally conductive material (chemistry not stated)
New heat dissipation product announced in the battery guide.
View technical data →MG Chemicals
Silicone-free thermal paste
High-conductivity silicone-free thermal paste, also proposed as a gap filler in batteries.
View technical data →MG Chemicals
2K thermally conductive potting epoxy
Thermally conductive (non-flame-retardant) potting epoxy for LED drivers and strips and battery modules.
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid, thermally conductive, flame-retardant epoxy encapsulant (non-halogenated fillers) for batteries, LED drivers and electronics with fire risk.
View technical data →MG Chemicals
2K thermally conductive flame-retardant potting epoxy
Rigid thermally conductive, flame-retardant epoxy encapsulant, UL94 V-0 certified, for LED drivers and battery packs.
View technical data →Momentive
1K thermally conductive silicone, heat cure
Heat-curing grey thermally conductive silicone adhesive for heat dissipation in electronics.
View technical data →Momentive
1K thermally conductive silicone, heat cure
Grey thermally conductive silicone adhesive with higher conductivity and hardness for thermal interfaces in electronics.
View technical data →SilTrust
2K addition-cure silicone, heat cure, thermally conductive
Black 1:1 two-component heat-curing silicone encapsulant, self-extinguishing and slightly thermally conductive, for electrical and motor potting.
View technical data →MG Chemicals
Safety Wash II electronics cleaner (aerosol)
Plastic-safe blend of polar and non-polar solvents with improved cleaning power, for maintenance and post-production PCB cleaning.
View technical data →MG Chemicals
Super Wash electronics cleaner (aerosol)
Very fast-drying cleaner, safe on plastics.
View technical data →MG Chemicals
Super HFE electronics cleaner (aerosol)
Non-flammable aerosol cleaner with strong cleaning power; excellent against flux residues, oils and greases.
View technical data →MG Chemicals
HFE solvent (aerosol)
Non-flammable degreasing cleaner, safe on plastics and suitable for energised circuits.
View technical data →SilTrust
1K solvent-free silicone conformal coating
Clear silicone conformal coating for PCBs, fast-curing at room temperature or in a low-temperature oven.
View technical data →Novasil
1K silicone, modified amine-oxime system, MEKO-free, self-levelling
Very soft self-levelling one-component silicone designed for potting and filling electronic and lighting components.
View technical data →Novasil
2K potting silicone, alkoxy condensation
Fluid, white, thermally conductive two-component potting compound with V-0 flame rating according to the brochure.
View technical data →Novasil
2K alkoxy potting silicone
Fluid black two-component potting compound with UL 94 V-0 flame rating for electronics.
View technical data →Novasil
1K alkoxy silicone, self-levelling, with UV indicator
Fluid silicone for thin-layer conformal coating of PCBs, with UV tracer for inspection.
View technical data →Novasil
2K condensation potting silicone
Fast, soft, clear two-component potting compound for electronics.
View technical data →Novasil
2K condensation potting silicone
White, low-viscosity two-component potting compound with slight thermal conductivity.
View technical data →Novasil
2K potting silicone, alkoxy condensation
Fluid, soft, black two-component potting compound, according to the electronics brochure.
View technical data →Novasil
2K condensation potting silicone
White, thermally conductive, self-extinguishing two-component potting compound for electronics.
View technical data →Novasil
RTV-2 addition-cure silicone gel (platinum)
Very fluid addition-cure silicone gel for protecting/encapsulating electronics.
View technical data →Novasil
RTV-2 addition-cure silicone gel (platinum)
Clear addition-cure silicone gel for electronics.
View technical data →Novasil
RTV-2 addition-cure silicone gel (platinum)
Higher-viscosity addition-cure silicone gel for electronics.
View technical data →Novasil
1K neutral silicone, self-levelling
Self-levelling neutral silicone with electrical insulation properties.
View technical data →Your privacy, your choice
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