Adhesives, sealants and surface preparation products for Electronics · PCBs, organised by application. We only list a product when its documentation covers that use.
Structalit
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White fluid neutral-cure silicone sealant, non-corrosive on copper/brass, for insulating and protecting PCBs and connections. Primers SS4004/SS4044/SS4179 on difficult substrates.
View technical data →Structalit
1K modified epoxy with quartz filler (65 %), heat cure
High-Tg, low-CTE underfill with good flow at elevated temperature, for protecting joints under components.
View technical data →Vitralit
1K epoxy, UV + heat cure
UV/thermal encapsulant for soldered joints and connector solder points and for flexible conductors, with high adhesion to polyimide and low halogen content.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure, fluorescent
Fluorescent potting material, easy to dispense and fast curing, flux-compatible and pseudoplastic.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
High-Tg adhesive with deep cure and moisture post-cure for batteries and connector bonding; flux-compatible and low ionic content.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
Connector bonding adhesive that passes UL94 HB, high Tg, fast cure, flux-compatible and low ionic content.
View technical data →Vitralit
1K epoxy, UV cure, Black & Light technology
Thick-layer UV-curable black adhesive (Black & Light) for encapsulation, light shielding and lens bonding; low shrinkage.
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
View technical data →Vitralit
Acrylate, UV/VIS cure (+ heat according to the Automotive brochure), fluorescent
Soft elastic coating for flexible circuits (FPCB) and conformal coating, fast curing with a dry, tack-free surface.
View technical data →Vitralit
Acrylate, UV/VIS cure
Dry-surface, flexible, tear-resistant UV adhesive with good resistance to moisture and thermal cycling, for edge bonding and glass/plastic bonding; CMR-free.
View technical data →Structalit
1K epoxy, heat cure
Black fill material for PCB encapsulation (e.g. level sensors) and frame & fill, with very high chemical, thermal and shock resistance.
View technical data →Structalit
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
View technical data →Structalit
1K epoxy, heat cure
Stable high-Tg black epoxy as the frame in frame & fill with the Structalit 5717/5719/5720 fills and for edge bonding; no bleeding and very low ionic content, suitable for semiconductors.
View technical data →Structalit
2K epoxy, room-temperature/heat cure
Two-component epoxy for PCB potting with high resistance to grease, oil, chemicals and moisture, low shrinkage and high adhesion to metal, glass and plastic.
View technical data →Structalit
2K epoxy, heat/room-temperature cure
Clear low-viscosity two-component epoxy for PCB potting, resistant to moisture and chemicals.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
View technical data →Momentive
1K alkoxy (neutral) RTV silicone, electronic grade
White fluid neutral-cure silicone sealant, non-corrosive on copper/brass, for insulating and protecting PCBs and connections. Primers SS4004/SS4044/SS4179 on difficult substrates.
View technical data →Hoenle Eleco
1K modified acrylate-isocyanate, UV/visible cure with secondary moisture cure in shadow areas
UV-curing acrylate with secondary moisture cure for encapsulating components on boards.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
High-Tg adhesive with deep cure and moisture post-cure for batteries and connector bonding; flux-compatible and low ionic content.
View technical data →Vitralit
1K acrylate, UV/VIS + moisture cure
Connector bonding adhesive that passes UL94 HB, high Tg, fast cure, flux-compatible and low ionic content.
View technical data →Vitralit
1K epoxy, UV cure, Black & Light technology
Thick-layer UV-curable black adhesive (Black & Light) for encapsulation, light shielding and lens bonding; low shrinkage.
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
View technical data →Vitralit
Acrylate, UV/VIS cure
Flexible UV adhesive with a dry surface and excellent adhesion to glass and plastics, for medical devices (ISO 10993-5) and luxury packaging.
View technical data →Vitralit
Acrylate, UV/VIS cure
Dry-surface, flexible, tear-resistant UV adhesive with good resistance to moisture and thermal cycling, for edge bonding and glass/plastic bonding; CMR-free.
View technical data →Vitralit
UV/VIS + moisture cure
Adhesive for flexible electronics with high adhesion to various substrates, UV fixing and moisture post-cure in shadow areas.
View technical data →Vitralit
UV/VIS + heat cure, fluorescent
Fluorescent adhesive for flexible electronics with high adhesion to various substrates, UV fixing and thermal post-cure in shadow areas.
View technical data →Hoenle Eleco
1K modified acrylate-isocyanate, UV/visible cure with secondary moisture cure in shadow areas
UV-curing acrylate with secondary moisture cure for encapsulating components on boards.
View technical data →Elecolit
2K silver-filled epoxy, room-temperature/heat cure
Two-component silver conductive adhesive curing at room temperature, for heat-sensitive components; electrically and thermally conductive.
View technical data →Elecolit
1K epoxy, heat cure (snap cure / thermode)
Very flexible conductive adhesive for foil substrates (flex PCB, metal foils), organic photovoltaics and die attach; cures from 80 °C, snap cure or by thermode.
View technical data →MG Chemicals
Nickel-filled acrylic conductive pen
Nickel conductive pen for moderate-conductivity repairs such as PCB bridges and tracks.
View technical data →Vitralit
1K epoxy, UV + heat cure, thermally conductive
Thixotropic, thermally conductive UV/thermal epoxy for NTC glob top, frame in frame & fill, heat sink bonding and active alignment; low water absorption, low outgassing and low shrinkage.
View technical data →Elecolit
2K silver-filled epoxy, room-temperature/heat cure
Two-component silver conductive adhesive curing at room temperature, for heat-sensitive components; electrically and thermally conductive.
View technical data →Elecolit
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
View technical data →MG Chemicals
Safety Wash II electronics cleaner (aerosol)
Plastic-safe blend of polar and non-polar solvents with improved cleaning power, for maintenance and post-production PCB cleaning.
View technical data →SilTrust
1K solvent-free silicone conformal coating
Clear silicone conformal coating for PCBs, fast-curing at room temperature or in a low-temperature oven.
View technical data →Novasil
1K alkoxy silicone, self-levelling, with UV indicator
Fluid silicone for thin-layer conformal coating of PCBs, with UV tracer for inspection.
View technical data →Your privacy, your choice
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